Almost all electronic gadgets and devices have printed circuit boards as part of the components that constitute them. Manufacturing of PCB is not a difficult process and even amateur electricians can just provide the manufacturer with their own designs in order to get it done. The boards are divided into three categories; multi layer, single and double side boards. Conduction of these boards is usually done using copper, nickel or aluminum based material. The material is chosen depending on how complex or dense the circuits are. Described here is the process followed when going about creating them and the stages involved.
A conductive material is used to plate the backing. Conduction between the layers is enhanced by drilling holes into the backing. To remove any small conductor particles that may be present, the board is scrubbed. Filtration process is applied to recycle the recovered particles. This is because, if not recycled, the copper may form a mixture with the other wastes and then become quite hazardous to the environment.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Alternative resists can also be obtained by use of other volatile organic compounds or photosensitive ones. These ones can be applied either wet or dry. When exposed to ultraviolet light, the compounds normally harden.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.
A conductive material is used to plate the backing. Conduction between the layers is enhanced by drilling holes into the backing. To remove any small conductor particles that may be present, the board is scrubbed. Filtration process is applied to recycle the recovered particles. This is because, if not recycled, the copper may form a mixture with the other wastes and then become quite hazardous to the environment.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Alternative resists can also be obtained by use of other volatile organic compounds or photosensitive ones. These ones can be applied either wet or dry. When exposed to ultraviolet light, the compounds normally harden.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.
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